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| KSB13003A 0 KSB13003A SEMIHOW REV.A1,Oct 2007 KSB13003A 0 KSB13003A High Voltage Switch Mode Application g g pp * High Speed Switching * Suitable for Electronic Ballast up to 21W 1.5 Amperes NPN Silicon Power Transistor 1.1 Watts Absolute Maximum Ratings CHARACTERISTICS Collector-Base Voltage Collector-Emitter Collector Emitter Voltage Emitter-Base Voltage Collector Current(DC) Collector Current(Pulse) Base Current Collector Dissipation(Tc=25) Junction Temperature Storage Temperature TC=25 unless otherwise noted SYMBOL VCBO VCEO VEBO IC ICP IB PC TJ TSTG RATING 700 400 9 1.5 3 0.75 1.10 150 -65~150 UNIT V V V A A A W TO-92 1. Base 2. Collector 3. Emitter 3 1 2 Electrical Characteristics CHARACTERISTICS Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter Cut-off Current *DC Current Gain *Collector-Emitter Saturation Voltage TC=25 unless otherwise noted SYMBOL VCBO VCEO IEBO hFE1 hFE2 VCE(sat) Test Condition IC=500A, IE=0 IC=5mA, IB=0 VEB=9V,IC=0 VCE=2V,IC=0.5A VCE=2V,IC=1A IC=0.5A,IB=0.1A IC=1A,IB=0.25A IC=1.5A,IB=0.5A IC=0.5A,IB=0.1A IC=1A,IB=0.25A VCB=10V, f=0.1MHz Min 700 400 Typ. Max Unit V V 10 8 5 35 0.5 1.0 3.0 1.0 1.2 21 4 1.1 4.0 0.7 V V V V V *Base-Emitter Saturation Voltage Output Capacitance Current Gain Bandwidth P d t C t G i B d idth Product Turn on Time Storage Time Fall Time * Pulse Test: Pulse Width300s, Duty Cycle2% VBE(sat) Cob fT ton tstg tF VCE=10V,IC=0.1A 10V I 0 1A Vcc=125V, Ic=2A IB1=0.2A, IB2= -0.2A RL=125 Note. hFE1 Classification R O Y G 9 ~ 16 14 ~ 21 19 ~ 26 25 ~ 35 Package Mark information. S A 13003 YWW Z S YWW Z SemiHow Symbol Y; year code, WW; week code hFE1 Classification SEMIHOW REV.A1,Oct 2007 KSB13003A 0 Typical Characteristics SEMIHOW REV.A1,Oct 2007 KSB13003A 0 Typical Characteristics SEMIHOW REV.A1,Oct 2007 KSB130 003A Package Dimension TOTO-92 4.580.25 4.580.25 3 3.710.2 4 0.460.1 14.470.5 7 1.27typ 1 27t 1.27typ 3.60.25 1.020.1 25 3.710.2 Dimensions in Millimeters SEMIHOW REV.A1,Oct 2007 KSB130 003A Package Dimension TOTO-92 TAPING W2 W W1 W0 D0 F1 F2 P1 P P2 Dimension [mm] Item Component pitch Side lead to center of feed hole Center lead to center of feed hole Lead pitch Carrier Tape width Adhesive tape width Tape feed hole location Adhesive tape position Center of feed hole to bottom of component Center of feed hole to lead form Component height Tape feed hole diameter Symbol Reference P P1 P2 FI,F2 W W0 W1 W2 H H0 H1 D0 4.0 19.5 16.0 27.0 max 0.2 12.7 3.85 6.35 2.5 18.0 6.0 9.0 1.0 MAX 1 0.5 Tolerance 0.5 0.5 0.5 +0.2/-0.1 +1.0/-0.5 0.5 0.5 H0 H SEMIHOW REV.A1,Oct 2007 H1 |
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